View SFH4232_8920266.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

2015-12-01 1 2015-12-01 high power infrared emitter (850 nm) version 1.4 sfh 4232 ordering information features: ? ir lightsource with high efficiency ? low thermal resistance (max. 9 k/w) ? centroid wavelength 850 nm ? superior corrosion robustness (see chapter package outlines) ? the product qualification test plan is based on the guidelines of aec-q101-rev-c, stress test qualific ation for automotive grade discrete semiconductors. ? package: smt package applications ? infrared illumination for cameras ? surveillance systems ? machine vision systems notes depending on the mode of operation, these devices e mit highly concentrated non visible infrared light which can be hazardous to the human eye. products which i ncorporate these devices have to follow the safety precautions given in iec 60825-1 and iec 62471. type: total radiant flux ordering code e [mw] i f = 1a, t p = 10 ms sfh 4232 530 (320) q65110a8754 note: measured with integrating sphere.
2015-12-01 2 version 1.4 sfh 4232 maximum ratings (t a = 25 c) characteristics (t a = 25 c) parameter symbol values unit operation and storage temperature range t op ; t stg -40 ... 125 c junction temperature t j 145 c reverse voltage v r 1 v forward current i f 1000 ma surge current (t p 200 s, d = 0) i fsm 5 a power consumption p tot 1800 mw esd withstand voltage (acc. to ansi/ esda/ jedec js-001 - hbm) v esd 2 kv thermal resistance junction - soldering point r thjs 9 k / w parameter symbol values unit peak wavelength (i f = 1 a, t p = 10 ms) peak 860 nm centroid wavelength (i f = 1 a, t p = 10 ms) centroid 850 nm spectral bandwidth at 50% of i max (i f = 1 a, t p = 10 ms) ? 30 nm half angle ? 60 dimensions of active chip area l x w 1 x 1 mm x mm rise and fall times of i e ( 10% and 90% of i e max ) (i f = 5 a, r l = 50 ?) t r / t f 7 / 14 ns forward voltage (i f = 1 a, t p = 100 s) v f 1.5 ( 1.8) v forward voltage (i f = 5 a, t p = 100 s) v f 2 ( 2.9) v radiant intensity (i f = 1 a, t p = 100 s) i e, typ 180 mw/sr temperature coefficient of i e or e (i f = 1 a, t p = 10 ms) tc i -0.3 % / k temperature coefficient of v f (i f = 1 a, t p = 10 ms) tc v -1 mv / k temperature coefficient of wavelength (i f = 1 a, t p = 10 ms) tc , centroid 0.3 nm / k
version 1.4 sfh 4232 2015-12-01 3 grouping (t a = 25 c) group min total radiant flux max total radiant flux i f = 1a, t p = 10 ms i f = 1a, t p = 10 ms e min [mw] e max [mw] SFH4232 - cb 320 500 SFH4232 - da 400 630 SFH4232 - db 500 800 note: measured with integrating sphere. only one group in one package unit ( variation lowe r 1.6:1) relative spectral emission 1) page 12 i rel = f(), t a = 25c relative total radiant flux 1) page 12 e / e (1a) = f(i f ), t a = 25c, single pulse, t p = 100s 700 0 nm % ohf04132 20 40 60 80 100 950 750 800 850 i rel ohf03848 10 -3 a 10 1 0 10 55 10 -1-2 5 10 i f 10 10 0 10 1 10 5 5 -2 -1 (1 a) e e
2015-12-01 4 version 1.4 sfh 4232 max. permissible forward current i f = f(t s ), r thjs = 9 k/w forward current 1) page 12 i f = f(v f ), single pulse, t p = 100 s, t a = 25c permissible pulse handling capability i f = f(t p ), t s = 85 c, duty cycle d = parameter 0 0 ?c t i f a ohf04369 s 20 40 60 80 100 130 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.1 ohf03847 v f 0 10 10 1 10 -1 10 -2 f i a 0 v 0.5 1 1.5 2 2.5 0 -5 f i a t p s ohf04177 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 10 p t = d t t t p i f 0.010.33 0.5 0.2 0.1 0.02 d 0.005 = 0.05 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.5 1
version 1.4 sfh 4232 2015-12-01 5 radiation characteristics 1) page 12 i rel = f(?), t a = 25c package outline dimensions in mm (inch). cathode mark on the bottom side 0 0.2 0.4 1.00.8 0.6 ? 1.0 0.8 0.6 0.4 0? 10? 20? 40? 30? ohl01660 50?60? 70? 80? 90? 100? 0? 20? 40? 60? 80? 100? 120?
2015-12-01 6 version 1.4 sfh 4232 note: corrosion robustness better than en 60068-2-60 (met hod 4): with enhanced corrosion test: 40c / 90%rh / 15ppm h2s / 336h type: sfh 4232 package platinum dragon approximate weight: 0.2 g recommended solder pad dimensions in mm (inch). attention a n o d e a n d h e a t s i n k a r e e l e c t r i c a l l y c o n n e c t e d solder resist freies kupfer bare copper l?tpasten schablonesolder paste stencil l?tstopplack ohay0681 0.3 (0.012) kupfercopper 1.6 (0.063) 11.6 (0.457) 12.0 (0.472) 2.3 (0.091) 2.3 (0.091) 10 (0.394) 1.6 (0.063) 11.6 (0.457) 3 l?tstellen3 solder points thermal enhanced pcb thermisch optimiertes pcb ?4.0 (0.157) heatsink attach ?4.0 (0.157) ?2.5 (0.098)
version 1.4 sfh 4232 2015-12-01 7 reflow soldering profile product complies to msl level 2 acc. to jedec j-std -020d.01 0 0 s oha04525 50 100 150 200 250 300 50 100 150 200 250 300 t t ?c s t t p t t p 240 ?c 217 ?c 245 ?c 25 ?c l oha04612 profile featureprofil-charakteristik ramp-up rate to preheat* ) 25 c to 150 c 2 3 k/s time t s t smin to t smax t s t l t p t l t p 100 120 60 10 20 30 80 100 217 2 3 245 260 3 6 time25 c to t p time within 5 c of the specified peaktemperature t p - 5 k ramp-down rate*t p to 100 c all temperatures refer to the center of the package, measured on the top of the component* slope calculation d t/ d t: d t max. 5 s; fulfillment for the whole t-range ramp-up rate to peak* ) t smax to t p liquidus temperaturepeak temperature time above liquidus temperature symbolsymbol uniteinheit pb-free (snagcu) assembly minimum maximum recommendation k/sk/s s ss s c c 480
2015-12-01 8 version 1.4 sfh 4232 taping dimensions in mm (inch). tape and reel 24 mm tape with 800 pcs. on ? 180 mm reel ohay0508 1.55 (0.061) 2 (0.079) 4 (0.157) 6.35 (0.250) 8 (0.315) 1.75 (0.069) 11.5 (0.453) 12.4 (0.488) 24 (0.945) 0.3 (0.012) 0.3 (0.012) 1.9 (0.075) 7.35 (0.289) cathode/collector side d 0 2 p p 0 1 p w f e direction of unreeling n w 1 2 w a ohay0324 label leader: trailer: 13.0 direction of unreeling 0.25 min. 160 mm * min. 400 mm * *) dimensions acc. to iec 60286-3; eia 481-d
version 1.4 sfh 4232 2015-12-01 9 tape dimensions [mm] tape dim ensions in m m reel dimensions [mm] reel dim ensions in m m barcode-product-label (bpl) dry packing process and materials note: moisture-sensitive product is packed in a dry bag c ontaining desiccant and a humidity card. regarding dry pack you will find further informatio n in the internet. here you will also find the norm ative references like jedec. w p 0 p 1 p 2 d 0 e f 24 + 0.3 / - 0.1 4 0.1 8 0.1 or 12 0.1 2 0.1 1.5 0.1 1.75 0.1 11.5 0.05 a w n min w 1 w 2max 180 24 60 / 100 24.4 + 2 30.4 oha04563 (g) group: 1234567890 (1t) lot no: (9d) d/c: 1234 (x) prod no: 123456789 (6p) batch no: 1234567890 lx xxxx rohs compliant bin1: xx-xx-x-xxx-x ml x temp st xxx c x pack: rxx demy xxx x_x123_1234.1234 x 9999 (q)qty: semiconductors osram opto xx-xx-x-x example x_x123_1234.1234 x x_x123_1234.1234 x example example example xxx xxx x_x123_1234.1234 x x_x123_1234.1234 x xx-xx-x-x xx-xx-x-x example example example example example example example xxx xxx x_x123_1234.1234 x x_x123_1234.1234 x xx-xx-x-x xx-xx-x-x example pack: rxx xxx x_x123_1234.1234 x x_x123_1234.1234 x xx-xx-x-x example pack: rxx pack: rxx demy demy example 1234 1234 example example example example example example example example example (9d) d/c: (9d) d/c: 1234 1234 example example example example example 1234 1234 example pack: rxx pack: rxx demy example example example example example (9d) d/c: (9d) d/c: example example example example (9d) d/c: 1234 example example example example (9d) d/c: example example example example example example example example example example example example example example example example example example example example example 1234567890 1234567890 example example example example example example example example example example example example example example example example example example example example example example (6p) batch no: (6p) batch no: 1234567890 1234567890 semiconductors semiconductors example example example example example example example example example (6p) batch no: (6p) batch no: 1234567890 1234567890 example semiconductors semiconductors osram opto osram opto example example 1234567890 x_x123_1234.1234 x pack: rxx demy x_x123_1234.1234 x (9d) d/c: 1234 (9d) d/c: 1234567890 (6p) batch no: 1234567890 osram opto xxx x_x123_1234.1234 x xx-xx-x-x pack: rxx demy semiconductors oha00539 osram moisture-sensitive label or print barcode label desiccant humidity indicator barcode label osram please check the hic immidiately after bag opening. discard if circles overrun. avoid metal contact. wet do not eat. comparatorcheck dot parts still adequately dry.examine units, if necessary examine units, if necessary 5% 15% 10% bake unitsbake units if wet, change desiccantif wet, humidity indicator mil-i-8835 if wet, moisture level 3 floor time 168 hours moisture level 6 floor time 6 hours a) humidity indicator card is > 10% when read at 23 ?c 5 ?c, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. after this bag is opened, devices that will be subjected to infrared 1. shelf life in sealed bag: 24 months at < 40 ?c and < 90% relative humidity (rh). moisture level 5a at factory conditions of (if blank, seal date is identical with date code). a) mounted withinb) stored at body temp. 3. devices require baking, before mounting, if:bag seal date moisture level 1 moisture level 2 moisture level 2a 4. if baking is required, b) 2a or 2b is not met. date and time opened: reference ipc/jedec j-std-033 for bake procedure. floor time see below if blank, see bar code label floor time > 1 yearfloor time 1 year floor time 4 weeks 10% rh. _ < moisture level 4moisture level 5 ?c). opto semiconductors moisture sensitive this bag contains caution floor time 72 hoursfloor time 48 hours floor time 24 hours 30 ?c/60% rh. _ < level if blank, seebar code label
2015-12-01 10 version 1.4 sfh 4232 transportation packing and materials dimensions of transportation box in mm width length height 195 5 195 5 42 5 oha02044 packvar: r077 additional text p-1+q-1 multi topled muster osram optosemiconductors (6p) batch no: (x) prod no: 1 0 (9d) d/c: 11 (1t) lot no: 210021998 123gh1234 0 24 5 (q)qty: 2000 0144 (g) group: 260 c rt 240 c r 3 220 c r ml bin3: bin2: q-1-20 bin1: p-1-20 lsy t676 22a temp st r18 demy packvar: r077 additional text p-1+q-1 multi topled muster osram opto semiconductors (6p) batch no: (x) prod no: 1 0 (9d) d/c: 11 (1t) lot no: 210021998 123gh1234 0 2 4 5 (q)qty: 2000 0144 (g) group: 260 c rt 240 c r 3 220 c r ml bin3: bin2: q-1-20 bin1: p-1-20 lsy t676 22a temp st r18 demy osram packingsealing label barcode label moisture level 3 floor time 168 hours moisture level 6 floor time 6 hours a) humidity indicator card is > 10% when read at 23 ?c 5 ?c, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. after this bag is opened, devices that will be subjected to infrared 1. shelf life in sealed bag: 24 months at < 40 ?c and < 90% relative humidity (rh). moisture level 5a at factory conditions of (if blank, seal date is identical with date code). a) mounted withinb) stored at body temp. 3. devices require baking, before mounting, if:bag seal date moisture level 1 moisture level 2 moisture level 2a 4. if baking is required, b) 2a or 2b is not met. date and time opened: reference ipc/jedec j-std-033 for bake procedure. floor time see below if blank, see bar code label floor time > 1 yearfloor time 1 year floor time 4 weeks 10% rh. _ < moisture level 4moisture level 5 ?c). opto semiconductors moisture sensitive this bag contains caution floor time 72 hoursfloor time 48 hours floor time 24 hours 30 ?c/60% rh. _ < level if blank, seebar code label barcode label
version 1.4 sfh 4232 2015-12-01 11 disclaimer language english will prevail in case of any discre pancies or deviations between the two language word ings. attention please! the information describes the type of component and shall not be considered as assured characteristics . terms of delivery and rights to change design reser ved. due to technical requirements components may c ontain dangerous substances. for information on the types in question please con tact our sales organization. if printed or downloaded, please find the latest ve rsion in the internet. packing please use the recycling operators known to you. we can also help you C get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport . for packing material that is returned to us unsorted or which w e are not obliged to accept, we shall have to invoi ce you for any costs incurred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components* may only be used in life-suppo rt devices** or systems with the express written ap proval of osram os. *) a critical component is a component used in a li fe-support device or system whose failure can reaso nably be expected to cause the failure of that life-support device or system, or to affect its safety or the ef fectiveness of that device or system. **) life support devices or systems are intended (a ) to be implanted in the human body, or (b) to supp ort and/or maintain and sustain human life. if they fail, it i s reasonable to assume that the health and the life of the user may be endangered.
2015-12-01 12 version 1.4 sfh 4232 glossary 1) typical values: due to the special conditions of the manufacturing processes of led, the typical data or calculated correlations of technical parameters can only reflect statistical figures. these do not nec essarily correspond to the actual parameters of each single product, which could differ from the typical data a nd calculated correlations or the typical characteristic line. if requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
2015-12-01 13 version 1.4 sfh 4232 published by osram opto semiconductors gmbh leibnizstra?e 4, d-93055 regensburg www.osram-os.com ? all rights reserved.

▲Up To Search▲

Price & Availability of SFH4232

	To Download SFH4232 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .